The use of a high wattage soldering iron when soldering or desoldering components on a printed circuit board may cause which of the following faults to occur?
A
The flux may not spread evenly.
B
The foil circuitry bonded to the board may separate from the surface.
C
The solder may not harden properly.
D
The conductivity of the solder will decrease.
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Question 1 / 205eccefa4bacbc34ba4d484f4
Question 1 of 205eccefa4bacbc34ba4d484f4
The use of a high wattage soldering iron when soldering or desoldering components on a printed circuit board may cause which of the following faults to occur?
The use of a high wattage soldering iron when soldering or desoldering components on a printed circuit board may cause which of the following faults to occur?