The use of a high wattage soldering iron when soldering or desoldering components on a printed circuit board may cause which of the following faults to occur?
• Heat transfer in soldering – what happens to the PCB (printed circuit board) when too much heat is applied? • Foil/trace adhesion – how the thin copper foil is attached to the fiberglass board. • Flux and solder behavior – which problems are usually caused by too little heat vs. too much heat?
• Think about what part of a printed circuit board is most fragile when exposed to excessive heat: the component, the solder joint, or the thin copper foil bonded to the board? • Which of the listed problems is commonly associated with insufficient heat (cold joints, poor wetting) rather than excessive heat? • If the iron is very high wattage and you leave it on the pad too long, what visible physical damage could you see on the board itself?
• Identify which option involves physical damage to the board or copper foil rather than just the solder properties. • Eliminate any choices that are more typical of low temperature / cold solder joints, not overheating. • Ask yourself: with too much heat, is the main risk a change in the electrical properties of solder, or mechanical damage/separation of PCB layers?
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